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Intel Corp is spending US$7.1 billion on new chip packaging amenities in Malaysia, a serious funding to ramp up its world footprint and handle a crippling world chip scarcity it expects to persist till 2023.The corporate is earmarking greater than 30 billion ringgit towards increasing its capability within the nation, chief govt officer Pat Gelsinger advised reporters Thursday. A part of that can bankroll a brand new packaging plant anticipated to start manufacturing in 2024, he mentioned.The mission marks a giant guess…
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